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Patent Searching and Data


Title:
MOLDING APPARATUS, MOLDING METHOD, AND PROGRAM
Document Type and Number:
Japanese Patent JP2022132894
Kind Code:
A
Abstract:
To obtain a molding layer with a high average density of solidified powder.SOLUTION: A three-dimensional molding apparatus 100 includes: a molding tank 22 that is an example of the molding tank 22 in which a powder 20 is placed; a flattening roller 12, which is an example of a flattening unit that flattens a surface of the powder 20 supplied to the molding tank 22 to form a powder layer 31; a head 52 that is an example of a solidification unit that solidifies the powder layer 31 placed in the molding tank 22 to form a molding layer 30; and a control unit 500 that controls the flattening roller 12 to form a first powder layer 31A and then forms a second powder layer 31B by the flattening roller 12 on the unsolidified first powder layer 31A, and further controls the head 52 to solidify the first powder layer 31A and the second powder layer 31B, thereby forming the molding layer 30.SELECTED DRAWING: Figure 8

Inventors:
KOIKE YUTA
NAGATOMO YUJI
NAKAZAWA SOICHI
HASHIMOTO KENICHIRO
SUGIURA KENJI
TAKAGI YUKI
Application Number:
JP2021031614A
Publication Date:
September 13, 2022
Filing Date:
March 01, 2021
Export Citation:
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Assignee:
RICOH CO LTD
International Classes:
B29C64/188; B22F3/16; B22F10/85; B22F12/63; B28B1/30; B29C64/153; B29C64/165; B29C64/218; B29C64/393; B33Y10/00; B33Y30/00; B33Y50/02