Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
MOLDING APPARATUS, MOLDING METHOD, AND MOLDING SYSTEM
Document Type and Number:
Japanese Patent JP2019142149
Kind Code:
A
Abstract:
To stably perform molding with improved adhesiveness between molding material layers.SOLUTION: A heating module 20 in a three-dimensional molding apparatus 1 heats a molding material layer Ln-1 formed of a filament. A discharge module 10 in the three-dimensional molding apparatus 1 discharges a molten filament to the heated molding material layer Ln-1 to layer a subsequent molding material layer Ln. A control portion 100 in the three-dimensional molding apparatus 1 includes a temperature information output portion 160 that outputs temperature information about the temperature of the molding material layer Ln-1 formed of the filament.SELECTED DRAWING: Figure 13

More Like This:
JP6745240Systems and methods for forming integrated interfaces within 3D printed matter with different modeling materials
WO/2022/022762METHOD FOR MONITORING A SURFACE PROFILE IN A 3D PRINTER
JP6538435Support placement determination device, 3D modeling system, and support placement determination method
Inventors:
TAKEYAMA YOSHINOBU
ITO YOICHI
TAKAI ATSUSHI
ARAO TSUYOSHI
AKIEDA TOMOMI
Application Number:
JP2018029775A
Publication Date:
August 29, 2019
Filing Date:
February 22, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
RICOH CO LTD
International Classes:
B29C64/386; B29C64/118; B29C64/295; B33Y10/00; B33Y30/00; B33Y50/00
Domestic Patent References:
JP2017523063A2017-08-17
JP2017077671A2017-04-27
Foreign References:
WO2017196344A12017-11-16
US20180017957A12018-01-18
US20170072633A12017-03-16
Attorney, Agent or Firm:
Shinya Mayama



 
Previous Patent: 造形装置、造形方法および造形システム

Next Patent: 造形装置、造形方法および造形システム