MOLDING APPARATUS, AND MOLDING METHOD

Title:

MOLDING APPARATUS, AND MOLDING METHOD

Document Type and Number:

Japanese Patent JP2014105364

Kind Code:

A

Abstract:

To provide a molding apparatus and a molding method that can uniformly coat an internal wall surface of a mold with a lubricant, for example when the lubricant is in a fluid state in the mold of high temperature.

A molding apparatus includes a mold 10 and an aligning mechanism 20. The mold 10 is equipped with an outer die 1 having a hollow 2 and with two punches 11, 12 movably arranged relatively to the outer die 1 in the hollow 2 of the outer die 1. In the mold 10, a cavity 5 is enclosed by the end faces 11a, 12a of the two punches 11, 12 facing each other and an inner peripheral surface 2b of the hollow 2 of the outer die 1. When at least one punch of the two punches 11, 12 moves relatively to the outer die 1, the aligning mechanism 20 guides the punch so that an axis L1 of at least one punch of the two punches 11,12 coincides with an axis L of the hollow 2 of the outer die 1.

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Inventors:

KATSUKAWA YASUHIRO
OISHI YUSUKE
HOSHINA EISUKE
SUGIYAMA MASAKI

Application Number:

JP2012259909A

Publication Date:

June 09, 2014

Filing Date:

November 28, 2012

Export Citation:

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Assignee:

TOYOTA MOTOR CORP

International Classes:

B22F3/035; B21J3/00; B21J13/02; B30B11/00; B30B11/02; B21D37/18

Domestic Patent References:

JPS5439306A	1979-03-26
JPS6121926A	1986-01-30
JP2000153400A	2000-06-06
JP2000135598A	2000-05-16
JPH0557496A	1993-03-09
JP2000135598A	2000-05-16
JPH0557496A	1993-03-09
JPS5439306A	1979-03-26
JPS6121926A	1986-01-30
JP2000153400A	2000-06-06

Foreign References:

US5747073A	1998-05-05
US5747073A	1998-05-05

Attorney, Agent or Firm:

Yusuke Hiraki
Sekiya Mitsuo
Ishikawa Takiharu
Naoki Takemura

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