Title:
MOLDING APPARATUS AND MOLDING METHOD
Document Type and Number:
Japanese Patent JP2017013351
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide means capable more suitably flattening an ink layer during molding a three-dimensional object.SOLUTION: A molding apparatus 10 includes an inkjet head 12, flattening means, a molding base 16, a main scanning drive part 14, and a lamination direction drive part 20 for changing a head-base distance that is a distance between the inkjet head 12 and the molding base 16. The molding apparatus molds a three-dimensional object by such a lamination molding method that in an operation of forming one ink layer, a main scanning operation to move the inkjet head 12 in one direction is repeated at the same position of a three-dimensional object 50 being molded, and that, referring to the head-base distance in the operation of forming the one ink layer, a head-base distance in the main scanning operation carried out later is increased than a head-base distance in the main scanning operation preliminarily carried out.SELECTED DRAWING: Figure 1
Inventors:
YASUMI KUNIO
EGUCHI TERUZUMI
EGUCHI TERUZUMI
Application Number:
JP2015132011A
Publication Date:
January 19, 2017
Filing Date:
June 30, 2015
Export Citation:
Assignee:
MIMAKI ENG CO LTD
International Classes:
B29C67/00; B33Y10/00; B33Y30/00
Domestic Patent References:
| JP2015000476A | 2015-01-05 | |||
| JP2008538329A | 2008-10-23 | |||
| JP2013067121A | 2013-04-18 |
Foreign References:
| WO2014068579A1 | 2014-05-08 |
Attorney, Agent or Firm:
Shigeki Orizaka
Naoki Kobayashi
Yasuo Fujimura
Naoki Kobayashi
Yasuo Fujimura
Previous Patent: A record method and an ink set
Next Patent: A shaping apparatus and a molding method
Next Patent: A shaping apparatus and a molding method