Title:
成形装置および方法
Document Type and Number:
Japanese Patent JP7149411
Kind Code:
B2
Abstract:
An injection molding apparatus comprises a support base and a mold carrier removably mounted to the support base. The mold carrier includes a mounting plate with attachment features for engaging the support base. A mold with two mold plates is slidably mounted to the mounting plate. A clamp is operable to move the plates between open and closed positions. In the closed position, the plates abut one another. In the open position, the plates are spaced apart for removing molded articles.
Inventors:
Niels, Joachim Johannes
Uremek, Adam Christopher
Jankob, Peter
Spider, Sven
Fish, Ralph Walter
Halter, Christoph
McLeod, Darling Albert
Guo, Ten
Nogueira, Joakim Martin
Uremek, Adam Christopher
Jankob, Peter
Spider, Sven
Fish, Ralph Walter
Halter, Christoph
McLeod, Darling Albert
Guo, Ten
Nogueira, Joakim Martin
Application Number:
JP2021511603A
Publication Date:
October 06, 2022
Filing Date:
August 29, 2019
Export Citation:
Assignee:
HUSKY INJECTION MOLDING SYSTEMS LIMITED
International Classes:
B29C31/02; B29C45/76
Domestic Patent References:
| JP63128909A | ||||
| JP63147621A | ||||
| JP5301275A | ||||
| JP10235701A |
Foreign References:
| US4528150 | ||||
| CN206718334U |
Attorney, Agent or Firm:
Okabe
Takao Ochi
Seiichiro Takahashi
Takao Ochi
Seiichiro Takahashi
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