To provide a molding apparatus for resin-sealing molding which can properly and surely support a substrate in position at closing, even if the substrate varies in thickness, and can stably carry out mold clamping operation without burrs or cracks being generated on the substrate.
Lower moving portions 18, 19 where the substrate 7 is mounted which slides upward/downward in a holder base 16 are located on a bottom mold 3, and wedge-shaped members 17A, 17B are positioned between the lower moving portions 18, 19 and the bottom of the holder base 16. The wedge-shaped member 17A is driven by an aircylinder etc. to move in the predetermined direction, thereby integrally supporting the lower moving portions 18, 19 on the mold by the holder base 16. The mold has a driving device 32, which can measure the position of the wedge-shaped member 17A by a gauge sensor, using an unit 30 for measuring the substrate thickness and an inspection plate of a known thickness, and accurately decides the position of the wedge-shaped member, when clamping the mold.
Yoshihiro Morimoto
Toshiji Sasahara
Yohei Harada
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