Title:
MOLDING APPARATUS
Document Type and Number:
Japanese Patent JP2023183341
Kind Code:
A
Abstract:
To provide a molding apparatus which enables dense temperature control and can efficiently achieve clean molding, in molding using a viscous material whose physical value such as viscosity is changed by a temperature.SOLUTION: A molding apparatus 1 includes a nozzle 4 for discharging a viscous material A, a material supply part 2 for supplying the viscous material A to the nozzle 4, a table 6 having an upper surface 6a for receiving the viscous material A discharged from the nozzle 4, and a control part 10 for controlling operation of the material supply part 2, and movement of the nozzle 4 and/or movement of the table 6, molds a molded article by the viscous material A discharged from the nozzle 4 onto the upper surface 6a of the table 6, further includes a first heat exchange part 12 which is arranged so as to be brought into contact with the nozzle 4 and is attachable/detachable to/from the nozzle 4, and controls the temperature of the viscous material A discharged from the nozzle 4 by controlling the first heat exchange part 12 by the control part 10.SELECTED DRAWING: Figure 1
Inventors:
TODA TOSHIYUKI
BASHER SAMIUL
BASHER SAMIUL
Application Number:
JP2022096905A
Publication Date:
December 27, 2023
Filing Date:
June 15, 2022
Export Citation:
Assignee:
SEIKI CORP
International Classes:
B29C64/393; B29C64/118; B29C64/209; B29C64/295; B33Y30/00; B33Y50/02; B33Y70/00
Attorney, Agent or Firm:
Toshikazu Kaji
Hideko Nakamura
Hideko Nakamura
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