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Title:
MOLDING APPARATUS
Document Type and Number:
Japanese Patent JPH06188279
Kind Code:
A
Abstract:

PURPOSE: To prevent a leakage of a molding resin securely when a resin sealing type semiconductor integrated circuit device is sealed with a resin.

CONSTITUTION: Resin dams 6 for resin outflow prevention are directly installed on an upper mold 3 and a lower mold 4 for resin sealing in a position in which a lead part of a lead frame 1 is interposed, and a leakage of a molding resin is prevented by blocking the gaps between both the molds 3 and 4 and the leads of the lead frame 1 with the resin dams 6 when the resin is injected.


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Inventors:
KURODA HIROSHI
MIWA TAKASHI
SHIRAI MASAYUKI
MATSUNAGA TOSHIHIRO
KUBOSONO MINORU
TSUBOI TOSHIHIRO
KOSAKU HIROSHI
KIKUCHI MASAYUKI
Application Number:
JP33833492A
Publication Date:
July 08, 1994
Filing Date:
December 18, 1992
Export Citation:
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Assignee:
HITACHI LTD
HITACHI VLSI ENG
International Classes:
H01L21/56; B29C45/14; (IPC1-7): H01L21/56
Attorney, Agent or Firm:
Ogawa Katsuo



 
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