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Patent Searching and Data


Title:
MOLDING AND ASSEMBLING DEVICE FOR RESIN PARTS
Document Type and Number:
Japanese Patent JPS6056832
Kind Code:
A
Abstract:

PURPOSE: To assemble resin parts for a short period of time after molding them by moving a pallet with a conveyor arranged on a base including an injection molding device fixed them facing to a molding device movable board and stopping the pallet at an assembling position.

CONSTITUTION: Resin material of a hopper 35 is molded by an injection cylinder 32, a top force 27, and a bottom tool 23. After completion of molding, the bottom tool 23 is lowered by a pneumatic cylinder 19 and a movable board 22, and the bottom tool is opened, allowing a molded article to be taken out from the bottom tool 23. Successively, after a gate is cut down at need and aging is slightly performed for said molded article, it is placed on a pallet 38, conveyed to an assembling position by a conveyor 37, and is assembled in a body to be assembled which is stopping on the conveyor by a stopping device. With such constitution, the molded parts can be assembled just after completion of assembling. In addition, the assembling device can be driven pneumatically and by a motor, thus preventing parts from being stained with oil.


Inventors:
KENMOCHI KATSUE
SAKAIRI TADASHI
MARUYAMA YOSHIO
ICHITENMANYA EIJI
Application Number:
JP16554383A
Publication Date:
April 02, 1985
Filing Date:
September 08, 1983
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
B23P21/00; B29C45/00; B23P19/00; B29C69/00; (IPC1-7): B23P21/00; B29C69/00
Domestic Patent References:
JPS512513A1976-01-10
JPS5249811A1977-04-21
Attorney, Agent or Firm:
Akira Kobiji (2 outside)