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Title:
MOLDING BASED ON HIGH-MOLECULAR POLYESTER
Document Type and Number:
Japanese Patent JP3258197
Kind Code:
B2
Abstract:

PURPOSE: To provide a molding based on a high-molecular polyester comprising an organic dicarboxylic acid and a specified diol, having been treated with an ionizing radiation after molding, being excellent in heat stability and soldering bath resistance, and being desirable as, e.g. a printed wiring sheet.
CONSTITUTION: There is provided the objective high-molecular polyester-based molding comprising units derived from (A) an organic dicarboxylic acid such as an aromatic dicarboxylic acid or the like and (B) (i) 0-99.9 mol.% alkanediol or cycloalkanediol having 2-12 carbon atoms in the carbon chain and (ii) 0.1-100 mol.% alkenediol (e.g. 2-butenediol-1,4 or the like) having 4-12 carbon atoms in the carbon chain and having been treated with an ionizing radiation after molding, wherein the dose is in the range of 200-2,000 KGy when component B contains more than 2.5 mol.% alkenediol, and it is in the range of 400-200 KGy when component B contains 0.1-2.5 mol.% alkenediol.


Inventors:
Volter Kleine Homann
Jürgen Finke
Thomas Grosse-Puppendaard
Afaphone Derby-Derm
Dieter Beer
Application Number:
JP9897195A
Publication Date:
February 18, 2002
Filing Date:
April 24, 1995
Export Citation:
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Assignee:
Degussa-Hüls Akchen Gesell Shaft
International Classes:
C08J5/00; B29C71/04; C08G63/52; C08J3/28; C08J7/00; C08L67/02; C08L67/06; B29C35/08; H05K1/03; H05K3/38; (IPC1-7): C08G63/52; C08J5/00
Domestic Patent References:
JP7149885A
Attorney, Agent or Firm:
Toshio Yano (2 outside)