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Patent Searching and Data


Title:
MOLDING COMPOSITION
Document Type and Number:
Japanese Patent JPH06240095
Kind Code:
A
Abstract:

PURPOSE: To improve physical-mechanical, tensile and thermal properties by incorporating a polyphenylene ether and a specific high-impact vinyl aromatic polymer.

CONSTITUTION: A composition is obtained by mixing (A) 5-60 wt.% polyphenylene ether having an average molecular weight of 5,000-120,000, and (B) 95-40 wt.% high-impact vinyl aromatic polymer containing (I) 30-90 wt.% polymodal vinyl aromatic monomer-conjugated diene block polymer having 55-85 wt.% vinyl aromatic monomer and represented by formula I or II (wherein S1 and S2 are each a non-elastomeric polymer block of a vinyl aromatic monomer; B, B1 and B2 are each an elastomeric copolymer block based on a conjugated diene) and (ii) 70-10 wt.% vinyl aromatic polymer containing 5-15 wt.% dispersed dienic rubber in the form of particles having a cellular structure and an average chord of not less than 1.2 Mm, wile, if necessary, adding not more than 50 wt.% reinforcing material such as an inorganic fiber, 0.05-5 wt.% stabilizer and an additive, optionally, at a temperature of 200-300°C.


Inventors:
DAARIO GIDOONI
JIAN KURAUDEIO FUASUURO
Application Number:
JP1411694A
Publication Date:
August 30, 1994
Filing Date:
January 13, 1994
Export Citation:
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Assignee:
ENICHEM SPA
International Classes:
C08K7/02; C08L51/04; C08L53/00; C08L53/02; C08L71/12; C08K5/00; (IPC1-7): C08L51/04; C08L51/04; C08K5/00; C08K7/02; C08L53/02; C08L71/12
Attorney, Agent or Firm:
Kimura Masami