Title:
MOLDING DEVICE, MOLDING METHOD, AND MOLDED ARTICLE
Document Type and Number:
Japanese Patent JP2013230652
Kind Code:
A
Abstract:
To suppress the deformation or skew of a resin-molded article even if resin molding is performed in a low-load state.
Microfine uneven surfaces 2 are formed on a fixing-side mold 3, and compound uneven surfaces 4 having compounded different size uneven parts are formed on a movable-side mold 5. Accordingly, even if resin molding is performed in the low-load state deformation or skew of the resin-molded article can be suppressed.
Inventors:
OKAMOTO SHOICHI
OKUBO NAOYUKI
YUKI MASAHIRO
OKUBO NAOYUKI
YUKI MASAHIRO
Application Number:
JP2012105008A
Publication Date:
November 14, 2013
Filing Date:
May 02, 2012
Export Citation:
Assignee:
PANASONIC CORP
International Classes:
B29C45/40; B29C45/37
Domestic Patent References:
| JP2008296538A | 2008-12-11 | |||
| JP2008238610A | 2008-10-09 | |||
| JP2004351614A | 2004-12-16 |
Attorney, Agent or Firm:
Morimoto International Patent Office