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Title:
MOLDING DEVICE AND MOLDING METHOD
Document Type and Number:
Japanese Patent JP2016019996
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a molding device which can suppress the lowering of the rigidity of a molding, and can mold a flange part having a desired thickness.SOLUTION: At least one of a cope 12 and a drag 11 being a pair is moved to a direction in which the cope and the drag are joined to each other, a main cavity part MC and a sub-cavity part SC communicating with the main cavity part MC are formed, a pipe part 100a of a metal pipe 100 is molded in the main cavity part MC by supplying a gas into a metal pipe material between the cope 12 and the drag 11, and a flange part 100b of the metal pipe 100 is molded in the sub-cavity part SC. A piston 94 is made to advance in the sub-cavity part SC by the control of the piston 94 by a control part, the molded flange part 100b is crushed, and a flange part 100c which is adjusted to be thin in thickness is thereby molded.SELECTED DRAWING: Figure 7

Inventors:
ISHIZUKA MASAYUKI
UENO KIJO
SAIGA MASAYUKI
KOMATSU TAKASHI
Application Number:
JP2014145194A
Publication Date:
February 04, 2016
Filing Date:
July 15, 2014
Export Citation:
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Assignee:
SUMITOMO HEAVY INDUSTRIES
LINZ RES ENGINEERING CO LTD
International Classes:
B21D26/035; B21D26/047
Domestic Patent References:
JP4920772B22012-04-18
JP2006061944A2006-03-09
JP2001259754A2001-09-25
JP2006122979A2006-05-18
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Yasuki Yanagi