Title:
MOLDING DEVICE AND METHOD
Document Type and Number:
Japanese Patent JP3486160
Kind Code:
B
Abstract:
PROBLEM TO BE SOLVED: To provide a molding device designed for cutting the manufacturing cost of moldings and increasing the productivity and upgrading the shaping properties as well as a molding method.
SOLUTION: A molding material 25 composed of a heat-plastic material is heated by the heating elements 35 and 36 of a heating means 26 in such a state that the molding material 25 is nipped between a pair of molding frames 24a and 24b with the peripheral parts of sheet bodies 22a and 22b composed of a flexible and heat-resistant material held by frame bodies 23a and 23b. Further, the thermally softened molding material 25 is placed, in such a state that it is nipped by the molding frames 24a and 24b, on the molding die faces 27 of a plurality of platelike support members 28. In addition a suction force is guided into a space 31 between the platelike support members 28 with the help of a suction means 32 and thus the molding material 25 is shaped.
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Inventors:
Sana, Shunichi
Application Number:
JP2000000250297
Publication Date:
October 24, 2003
Filing Date:
August 21, 2000
Export Citation:
Assignee:
KAWASAKI HEAVY IND LTD
International Classes:
B29C51/36; B29C51/10; B29C51/26; B29C51/42; B29C51/30; B29C51/10; B29C51/26; (IPC1-7): B29C51/36; B29C51/10; B29C51/26; B29C51/42