Title:
MOLDING DIE AND PRODUCTION METHOD THEREOF
Document Type and Number:
Japanese Patent JP2014173127
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a molding die capable of improving adhesion and followability of a hard film onto a die substrate, and to provide a production method thereof.SOLUTION: A molding die 1 is formed by coating a hard film 3 on the surface 200 of a die substrate 2. The die substrate 2 has from the surface 200 to a prescribed depth, a ground layer 21 to which a work hardening treatment is applied. The ground layer 21 has a first ground layer 211 and a second ground layer 212 formed on the first ground layer 211. At least one surface hardening treatment of nitriding and carburization is applied to the second ground layer 212 before or after applying the work hardening treatment.
Inventors:
MORITA KAZUHIRO
Application Number:
JP2013046413A
Publication Date:
September 22, 2014
Filing Date:
March 08, 2013
Export Citation:
Assignee:
DENSO CORP
International Classes:
C23C8/26; C21D1/06; C21D7/04; C21D7/06; C21D9/00; C23C8/20
Attorney, Agent or Firm:
Patent business corporation あいち international patent firm