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Title:
MOLDING DIE STRUCTURE FOR SEMI-SOLIDIFIED METAL PRODUCT, METHOD FOR MOLDING SEMI-SOLIDIFIED METAL PRODUCT AND SEMI-SOLIDIFIED METAL PRODUCT MOLDED THEREBY
Document Type and Number:
Japanese Patent JP2009106950
Kind Code:
A
Abstract:

To provide a molding die structure for semi-solidified metal product, a method for molding the semi-solidified metal product and the semi-solidified metal product molded thereby, with which a moldability of the semi-solidified metal is favorablely retained and at the same time, the reduction of a material and manufacturing costs and the simplification of a finishing work can be attained.

The molding die structure for semi-solidified metal product is adapted to carry out the pressurization/relative displacement to a lower die and an upper die, under state of filling-up the semi-solidified metal in a cavity formed with the die closing state of the both dies. Then, the upper die is provided with a runout space for semi-solidified metal communicated into the cavity in the course of the die closing as the plane surface position corresponding to a window part of the product after molding. At pressurization, the metal corresponding to the window part enters the run-out space of the upper die and thereby, this molding method is attained with the reduction of the pressurizing force, the downsizing of the molding machine and the simplification of the finish-treatment.


Inventors:
Nishioka, Tetsuya
Sasaki, Tsutomu
Application Number:
JP2007000279721
Publication Date:
May 21, 2009
Filing Date:
October 27, 2007
Export Citation:
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Assignee:
GOSHI GIKEN CO LTD
International Classes:
B22D18/02; B22D17/00
Attorney, Agent or Firm:
穴見 健策
高宮 章