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Patent Searching and Data


Title:
MOLDING DIE
Document Type and Number:
Japanese Patent JP2001170917
Kind Code:
A
Abstract:

To save on a manufacturing cost and make it easy to remove a molding material from a plurality of minute air holes formed in a template, even when the air holes are clogged with the molding material and further, enable a sharply patterned design to be stably formed.

A reinforcing frame 11 is fixed to at least the back peripheral edge part of a thin wall template 10 which has a pattern-molding face 1 formed on the surface and also a plurality of minute air holes 2 opened from the surface to the back. In addition, a back plate 5 in which a plurality of air holes 4 are opened from the surface to the back, is arranged, in a freely attachable/ detachable manner, opposite to the thin wall template 10, on the reinforcing frame 11. Further venting passages 14 which make each of the air holes 2 communicate with each of the air holes 4, are provided between the thin wall template 10 and the back plate 5 and a venting support member 15 for supporting the thin wall template 10 from the back is installed upright.


Inventors:
OGASAWARA MASANOBU
YOKOYAMA YOSHIHIRO
Application Number:
JP36179299A
Publication Date:
June 26, 2001
Filing Date:
December 20, 1999
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
B28B3/02; (IPC1-7): B28B3/02
Attorney, Agent or Firm:
Toshio Nishizawa