Title:
MOLDING DIE
Document Type and Number:
Japanese Patent JP2015093462
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a molding die capable of reducing a defective molded article.SOLUTION: In a molding die 10, a lead frame LF is clamped by an upper die 11 and a lower die 12 and a resin pressure-fed from a pot is charged into a die cavity through a plurality of resin paths L connected to a mold cull engraved on a die parting surface. Out of the plurality of resin paths L, a resin path L2 having a relatively long flow distance of the resin flowing from the pot to the die cavity is constituted so that a cross section orthogonal to the flow direction of the resin is expanded, and a resin path L1 having a relatively short flow distance is constituted so that a cross section orthogonal to the flow direction of the resin is narrowed.
Inventors:
SAITO TAKASHI
Application Number:
JP2013235406A
Publication Date:
May 18, 2015
Filing Date:
November 13, 2013
Export Citation:
Assignee:
APIC YAMADA CORP
International Classes:
B29C45/27; H01L21/56
Domestic Patent References:
| JPH03205117A | 1991-09-06 | |||
| JPH10270480A | 1998-10-09 | |||
| JPH09167781A | 1997-06-24 | |||
| JP2010111050A | 2010-05-20 | |||
| JPH03159142A | 1991-07-09 | |||
| JPH04147814A | 1992-05-21 |
Foreign References:
| US6656769B2 | 2003-12-02 |
Attorney, Agent or Firm:
Watanuki International Patent and Trademark Office