PURPOSE: To prevent failure such as disconnection of gold wire or the like from occurring by uniformizing the quality of resin encapsulation of each semiconductor chip by a method wherein a shutter is openably and closably provided at each one of gate parts connecting to a plurality of cavities of a molding die.
CONSTITUTION: A large number of cavities 3 are provided in the neighborhood of a runner 1 or a passage of resin 4 and connected through gate parts 2, which are normal to the runner 1, to the runner 1. At the runner 1 side end part of each gate part 2, a slit 5a, in which a shutter 5 is provided protrusively and retractably, is bored. The flows of the resin 4 running through the gate parts 2 are controlled by opening and closing the gate parts with the shutters 5 by means of an opening and closing mechanism. At resin encapsulation, when the whole runner 1 is filled with the resin 4 so far to its tip, the respective shutters 5 are simultaneously opened so as to release the gate parts 2. As a result, the resin 4 is poured simultaneously in the respective cavities 3. Accordingly, the resin is poured in the cavities 3 at the same speed at the same time.
UENO SUMIO
OGATA SHINICHI
| JPH05256942A | 1993-10-08 | |||
| JPH05232228A | 1993-09-07 | |||
| JPH0815415A | 1996-01-19 | |||
| JPH07325153A | 1995-12-12 | |||
| JPH07229965A | 1995-08-29 | |||
| JPS61149879A | 1986-07-08 |
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