Title:
MOLDING EQUIPMENT AND MOLDING METHOD USING SAME
Document Type and Number:
Japanese Patent JPH06232193
Kind Code:
A
Abstract:
PURPOSE: To surely eliminate flowing-out resin which leaks out at the time of resin molding process of a resin molded type semiconductor integrated circuit device, at the time of resin molding.
CONSTITUTION: At the position clamping the lead part of a lead frame 1, through holes 5, 6 are formed between leads of an upper mold 3 and a lower mold 4. At the time of resin molding, pressure fluid is applied to the through holes 5, 6 of the both molds 3, 4, and flowing-out resin which leaks out from a gap between the leads of the lead frame 1 is blown away and eliminated.
Inventors:
MIWA TAKASHI
MATSUNAGA TOSHIHIRO
KUBOSONO MINORU
SHIRAI MASAYUKI
TSUBOI TOSHIHIRO
KOSAKU HIROSHI
MATSUNAGA TOSHIHIRO
KUBOSONO MINORU
SHIRAI MASAYUKI
TSUBOI TOSHIHIRO
KOSAKU HIROSHI
Application Number:
JP1524593A
Publication Date:
August 19, 1994
Filing Date:
February 02, 1993
Export Citation:
Assignee:
HITACHI LTD
HITACHI VLSI ENG
HITACHI VLSI ENG
International Classes:
B29C45/02; B29C45/26; H01L21/56; H01L23/50; B29L31/34; (IPC1-7): H01L21/56; B29C45/02; B29C45/26; H01L23/50
Attorney, Agent or Firm:
Ogawa Katsuo