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Patent Searching and Data


Title:
MOLDING EQUIPMENT FOR RESIN MOLDED PRODUCT
Document Type and Number:
Japanese Patent JP3228443
Kind Code:
B2
Abstract:

PURPOSE: To provide the title equipment whose arrangement space can be made narrower than that of conventional one.
CONSTITUTION: A molding machine 1 integrally molding a base material and a resin sheet, a supply and taking-out station 12 supplying the base material or the like to the molding machine 1 and taking out a molded product from the molding machine 1 and the feed in and out device 13 arranged between the molding machine 1 and the supply and taking-out station 12 in a reciprocally movable manner and having a placing mechanism for the base material or the like provided to the upper part thereof and having a molded product sucking mechanism provided to the lower part thereof are provided. Further, a heating device 23 heating the base material or the like and the feed device 13 arranged between the molding machine 1 and the heating device 23 and equipped with two or more feed jigs for the base material or the like are provided.


Inventors:
Iwao Tomita
Yuji Abeta
Application Number:
JP2204193A
Publication Date:
November 12, 2001
Filing Date:
January 14, 1993
Export Citation:
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Assignee:
Shinto Industry Co., Ltd.
International Classes:
B29C43/18; B29C43/34; B29C51/12; B29C51/18; B29C51/26; B29L9/00; (IPC1-7): B29C51/18; B29C43/18; B29C43/34; B29C51/12
Domestic Patent References:
JP197622A
JP63252741A
JP53112966A