Title:
MOLDING DEVICE
Document Type and Number:
Japanese Patent JP2018001210
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a molding device capable of reducing an eddy current in a molding metal mold.SOLUTION: According to a molding device 10, a pair of electrodes 17 and 18 energizes a metallic pipe material 14 to carry out heating, and a gas supply mechanism 40 supplies gas into the heated metallic pipe material 14, so that the metallic pipe material 14 expands and contacts with a blow molding mold 13, thereby molding a metallic pipe 100. The pair of the electrodes 17 and 18 energizes the metallic pipe material 14, thereby generating an eddy current RC (refer to Fig. 7) in the blow molding mold 13. The blow molding mold 13 has an eddy current suppressing portion 110 which suppresses the generation of the eddy current RC in the blow molding mold 13, so that the generation of the eddy current RC in the blow molding mold 13 is suppressed. Consequently, the eddy current RC in the blow molding mold 13 can be reduced.SELECTED DRAWING: Figure 7
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Inventors:
ISHIZUKA MASAYUKI
Application Number:
JP2016130621A
Publication Date:
January 11, 2018
Filing Date:
June 30, 2016
Export Citation:
Assignee:
SUMITOMO HEAVY INDUSTRIES
International Classes:
B21D26/047; B21D37/01; B21D37/08; B21D37/16
Domestic Patent References:
| JPS5499768A | 1979-08-06 | |||
| JPH11114907A | 1999-04-27 |
Foreign References:
| US20070101786A1 | 2007-05-10 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Yasuki Yanagi
Yoshiki Kuroki
Yasuki Yanagi