Title:
Molding equipment
Document Type and Number:
Japanese Patent JP5934801
Kind Code:
B2
Inventors:
Matsutsuki Isao
Yoshihiro Yamamoto
Takashi Tanaka
Murofushi Isamu
Yoshihiro Yamamoto
Takashi Tanaka
Murofushi Isamu
Application Number:
JP2014538607A
Publication Date:
June 15, 2016
Filing Date:
September 26, 2013
Export Citation:
Assignee:
Toshiba Machine Co., Ltd.
International Classes:
C03B11/00
Domestic Patent References:
| JP2011006270A | 2011-01-13 | |||
| JP2012116705A | 2012-06-21 | |||
| JP2010089970A | 2010-04-22 |
Attorney, Agent or Firm:
Kurata Masatoshi
Nobuhisa Nogawa
Takashi Mine
Naoki Kono
Katsu Sunagawa
Tadashi Inoue
Tatsushi Sato
Takashi Okada
Mihoko Horiuchi
Nobuhisa Nogawa
Takashi Mine
Naoki Kono
Katsu Sunagawa
Tadashi Inoue
Tatsushi Sato
Takashi Okada
Mihoko Horiuchi