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Patent Searching and Data


Title:
MOLDING OF FLUOROPLASTIC
Document Type and Number:
Japanese Patent JPS6228215
Kind Code:
A
Abstract:

PURPOSE: To make the molding of fluoroplastic at elevated temperature unnecessary by a method wherein the product is molded by mixing water soluble low- boiling organic solvent with aqueous dispersions of fluoroplastic.

CONSTITUTION: Five to three hundred percent by volume of water soluble low- boiling organic solvent, the boiling point of which is 160°C or less, is added to 20W70% by weight of aqueous dispersion of polytetrafluoroethylene, tetrafluoroethylene or the like or their copolymer in order to obtain setting precipitate of fluoroplastic. The molding of the obtained setting precipitate of fluoroplastic is done at a temperature ranging from room temperature to 160°C under elevated or reduced pressure. Powder can be blended with the aqueous dispersion. As for the powder, any powder will do provided that the powder is insoluble to water and the water soluble low-boiling organic solvent employed, such as various kinds of polymer, carbon black, fine glass powder or the like. A molded fluoroplastic product is obtained by simultaneously removing both the water in the aqueous dispersion and the organic solvent for setting precipitate.


Inventors:
MURAKOSHI YOSHIHIKO
NAITO KAZUMI
IKEZAKI TAKASHI
Application Number:
JP16742285A
Publication Date:
February 06, 1987
Filing Date:
July 31, 1985
Export Citation:
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Assignee:
SHOWA DENKO KK
International Classes:
C08J5/02; B29C43/02; B29K27/12; (IPC1-7): B29C43/02; B29K27/12; C08J5/02
Attorney, Agent or Firm:
Aoki Akira