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Patent Searching and Data


Title:
MOLDING INTEGRATING CARRYING DEVICE AND MOLDING INTEGRATING CARRYING METHOD
Document Type and Number:
Japanese Patent JP2002018790
Kind Code:
A
Abstract:

To prevent moldings from changing in an integrating process, to integrate the moldings in an aligned state, to prevent an enlargement of a device, to reduce a frequency of discharging the moldings, to prevent reduction in throughput, and to carry the moldings to a post-process by lengthening a punching molding stack.

This device is provided with a plurality of-rows upper side punching blades 13-1 and 13-2 for trimming the moldings 18 molded on a resin sheet 17, a plurality of-row lower side punching blades 15-1 and 15-2 and a plurality of-row tilting bucket cylinders 51-1 and 51-2 arranged under the lower side punching blades 15-1 and 15-2, and the inside integrated moldings of the respective-row tilting bucket cylinders 51-1 and 51-2 are successively discharged after being horizontalized by tilting the tilting bucket cylinders 51-1 and 51-2 in a state of internally holding the integrated moldings.


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Inventors:
SAIGA MASAYUKI
MATSUURA EIJI
Application Number:
JP2000202998A
Publication Date:
January 22, 2002
Filing Date:
July 05, 2000
Export Citation:
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Assignee:
SUMITOMO HEAVY INDUSTRIES
International Classes:
B26D7/32; B23D33/00; B29C51/08; B29C51/10; B29C51/26; B65G65/23; (IPC1-7): B26D7/32; B29C51/08; B29C51/10; B29C51/26; B65G65/23
Attorney, Agent or Firm:
Toshiaki Aoki (2 outside)