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Title:
MOLDING MATERIAL, MOLDED ARTICLE, MANUFACTURING METHOD THEREFOR, AND HOUSING FOR ELECTRIC/ELECTRONIC EQUIPMENT
Document Type and Number:
Japanese Patent JP2011132435
Kind Code:
A
Abstract:

To provide a molding material excellent in all viewpoints of charpy impact strength, flexural modulus and dispersibility and making sufficient injuring-resistance and weather-resistance compatible.

The molding material includes a cellulose derivative containing at least one group (A) in which a hydrogen atom of a hydroxyl group contained in the cellulose is substituted by a 1-3C hydrocarbon group: -RA only comprising carbon and hydrogen and containing at least one group (B) in which the hydrogen atom of the hydroxyl group contained in the cellulose is substituted by an acyl group: -CO-RB (RB represents a hydrocarbon group only comprising carbon and hydrogen), and an aromatic polyamide.


Inventors:
MOROOKA NAOYUKI
YOSHITANI SHUNEI
KAMIHIRA SHIGEO
Application Number:
JP2009295066A
Publication Date:
July 07, 2011
Filing Date:
December 25, 2009
Export Citation:
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Assignee:
FUJIFILM CORP
International Classes:
C08L77/00; C08B11/02; C08B11/08; C08L1/32
Domestic Patent References:
JPH09188779A1997-07-22
JP2008266432A2008-11-06
JP2007099876A2007-04-19
JP2009114397A2009-05-28
JP2011132434A2011-07-07
JP2005283997A2005-10-13
JP2006111858A2006-04-27
Attorney, Agent or Firm:
Takeshi Takamatsu
Kiyozumi Yazawa