MOLDING MATERIAL, MOLDED ARTICLE, AND METHOD FOR PRODUCING THE SAME, AND HOUSING FOR ELECTRIC ELECTRONIC EQUIPMENT

Title:

MOLDING MATERIAL, MOLDED ARTICLE, AND METHOD FOR PRODUCING THE SAME, AND HOUSING FOR ELECTRIC ELECTRONIC EQUIPMENT

Document Type and Number:

Japanese Patent JP2011132459

Kind Code:

A

Abstract:

To provide a molding material which has good thermoplasticity, moldability, impact resistance, flexural strength, vibration-damping property.

The molding material comprises a cellulose derivative containing at least one group obtained by replacing the hydrogen atom of a hydroxyl group contained in the cellulose by (A) a hydrocarbon group: -RA and at least one group obtained by replacing the hydrogen atom of a hydroxyl group by (B) an acyl group: -CO-RB (RB is a hydrocarbon group), and a liquid-crystalline polymer.

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Inventors:

YOSHITANI SHUNEI
KAMIHIRA SHIGEO

Application Number:

JP2009295097A

Publication Date:

July 07, 2011

Filing Date:

December 25, 2009

Export Citation:

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Assignee:

FUJIFILM CORP

International Classes:

C08L1/08; C08B13/00; C08L67/04; G03G15/00

Domestic Patent References:

JPH11125714A	1999-05-11
JP2007231050A	2007-09-13
JP2007161943A	2007-06-28

Attorney, Agent or Firm:

Takeshi Takamatsu
Kiyozumi Yazawa

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