Title:
MOLDING MATERIAL AND MOLDED PART
Document Type and Number:
Japanese Patent JP2005255760
Kind Code:
A
Abstract:
To solve the problems comprising the lowering of productivity and the generation of molding defect caused by the lowering of the fluidity of a molding material in an ordinary molding material composed of a thermosetting resin mixed with a fibrous reinforcing material such as glass fiber to improve the mechanical property of the material.
The molding material contains a thermosetting resin and an inorganic filler. The thermosetting resin of uncured state contains an unsaturated polyester and a crosslinkable monomer, and the inorganic filler is mixed with layer clay mineral or carbon nanotube to improve the strength while suppressing the lowering of the fluidity of the molding material.
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Inventors:
YAMAGATA YOSHIKAZU
Application Number:
JP2004066894A
Publication Date:
September 22, 2005
Filing Date:
March 10, 2004
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
C08L67/06; C08K3/04; C08K3/34; C08K9/04; (IPC1-7): C08L67/06; C08K3/04; C08K3/34; C08K9/04
Attorney, Agent or Firm:
Fumio Iwahashi
Tomoyasu Sakaguchi
Hiroki Naito
Tomoyasu Sakaguchi
Hiroki Naito