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Patent Searching and Data


Title:
MOLDING MATERIAL FOR PHOTO-SETTING RESIN LOST MODEL, MOLD FORMED THEREOF, AND CASTING METHOD USING THE MOLD
Document Type and Number:
Japanese Patent JP2006247685
Kind Code:
A
Abstract:

To provide a molding material which can form a mold having high strength while withstanding the heat expansion of a lost pattern, a high-strength mold using the material, and a casting method which can produce a casting having excellent dimensional precision and cast surface by using the mold.

This molding material for photo-setting resin lost model contains: an aggregate component (A) which contains 80-25 mass% zircon sand (a1) and 0-45 mass% zircon flower (a2), in which (a1)+(a2) is 52-80 mass% of the total of aggregate components, which contain 10-25 mass% fused silica (a3) and 0-15 mass% silica rock (a4), in which (a3)+(a4) is 10-40 mass% of the total of aggregate components, and which contains 8-15 mass% milled fiber (a5); a binder component (B) which contains ethyl silicate hydrolysis solution (b-1) of 200-400 cm3 (volume in the case of standardizing the total mass 1 kg of the aggregate); and a curing agent (C) which contains 0.5-3 cm3 (volume in the case of being the total mass 1 kg of the aggregate). This mold and this casting method use the molding material.


Inventors:
SUZUKI HIROYUKI
TAKAOKA HIROSHI
Application Number:
JP2005065930A
Publication Date:
September 21, 2006
Filing Date:
March 09, 2005
Export Citation:
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Assignee:
JMC KK
International Classes:
B22C9/04; B22C1/00; B22C1/08; B22C7/02; B22D23/00; B29C67/00
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Nagasaka Tomoyasu
Masaya Nishiyama