To obtain the subject material containing an epoxy resin, a phenoxy resin, a phenolic compound, a specific blocked isocyanate, an inorganic filler and an organic solvent as essential components and giving a cured product having excellent tack-freeness, adhesivity and moisture resistant reliability.

This material contains, as essential components, (A) 100 pts.wt. of an epoxy resin such as bisphenol A epoxy resin, (B) 300-4,000 pts.wt. of a phenoxy resin, (C) a phenolic compound such as phenol (preferably in an amount to give an aromatic hydroxyl group equivalent of 0.7-1.2 based on 1 equivalent of epoxy group), (D) a blocked isocyanate blocked with an oxime compound and/or an alcohol compound (preferably in an amount to give an NCO equivalent/OH equivalent ratio of 0.05-0.3), (E) an inorganic filler such as fused silica (preferably ≥30vol.%) and (F) an organic solvent such as N,N- dimethylacetamide (preferably ≤60vol.%). The molding material is preferably used for the sealing of electronic parts.