To provide a molding material for a fluororesin that has an excellent electrical properties especially dielectric dissipation factor even in a microwave range, can mold at a lower pressure because of a low molecular weight polymer, is excellent in surface smoothness, and is useful as a material e.g. coating material such as a coaxial cable for equipment using microwave in a satellite communication or a mobile phone base station or the like.
The molding material for a tetrafluoroethylene resin excellent in high-frequency electric properties provides a resin that has ≤2.2 of permittivity at 12 GHz, ≤1.60×10-4 of a dielectric dissipation factor and ≥2.192 and <2.3 of standard specific gravity. For the tetrafluoroethylene resin, a homopolymer of tetrafluoroethylene or a copolymer composed of tetrafluoroethylene of 99.9-99.9999 mol% and a specified fluoromonomer of 0.0001-0.1 mol% is desirably used.
ASANO MICHIO
NANBA YOSHINORI
KASAI SHUNJI
YOSHIMOTO HIROYUKI
YANO SHINICHI
SHIMIZU TETSUO
| JPS6356532A | 1988-03-11 | |||
| JPS374643B1 | 1962-06-15 | |||
| JPH1053624A | 1998-02-24 | |||
| JPH02220389A | 1990-09-03 | |||
| JPH11185533A | 1999-07-09 | |||
| JPH03184209A | 1991-08-12 | |||
| JPH07272801A | 1995-10-20 |
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