Title:
MOLDING MATERIAL
Document Type and Number:
Japanese Patent JP3409446
Kind Code:
B2
Abstract:
PURPOSE: To provide a molding material suitable for lightweight and high- strength cores of the toes of shoes and shoes obtained by molding it.
CONSTITUTION: This material comprises a polyamide resin composition composed mainly of 40-90wt.% polyamide resin (A), 10-50wt.% fibrous reinforcement (B) and 0-20wt.% modified elastomer (C) (wherein the total of components A, B and C is 100wt.%).
Inventors:
Hideharu Tsuchikawa
Tetsuo Ito
Tetsuo Ito
Application Number:
JP16488294A
Publication Date:
May 26, 2003
Filing Date:
June 24, 1994
Export Citation:
Assignee:
JSR Corporation
International Classes:
A43B23/08; A43B23/17; C08K7/02; C08L77/00; C08L77/06; (IPC1-7): C08L77/06; A43B23/17; C08K7/02
Domestic Patent References:
| JP5105753A | ||||
| JP6222841A |
Attorney, Agent or Firm:
Shigetaka Shirai
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