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Patent Searching and Data


Title:
MOLDING METHOD OF DISC BOARD AND DEVICE THEREOF
Document Type and Number:
Japanese Patent JPH10244561
Kind Code:
A
Abstract:

To efficiently mold a disc board having a favorable molding appraisal by a method wherein a molding material, the amount of which exceeds the volume of a cavity, is filled by injection in the cavity under the pressure, which exceeds a molding clamping force, so as to detect the amount of a mold opening under increasing in order to perform a gate cutting on the basis of a detected amount of the mold opening.

A cavity 3 is formed by matching molds 1 and 2 with each other. The molds 1 and 2 are clamped with a predetermined mold clamping force. A molding material, the amount of which exceeds the volume of the cavity 3 is filled by injection in the cavity 3 under the pressure, which exceeds a mold clamping force, so as to detect the amount L of a mold opening with a detecting means 7. A controlling means 8, in which the amount of the mold opening set in advance such as 30-70μm is stored, compares the amount L of the mold opening detected with the detecting means 7 with the set amount of the mold opening so as to perform a gate cutting by advancing a male cutter 19 for fitting in a female cutter 18, when the detected amount L of the mold opening exceeds the set amount of the mold opening.


Inventors:
ASAI IKUO
Application Number:
JP5146797A
Publication Date:
September 14, 1998
Filing Date:
March 06, 1997
Export Citation:
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Assignee:
MEIKI SEISAKUSHO KK
International Classes:
B29C45/38; B29C45/26; B29C45/56; B29C45/80; B29L17/00; (IPC1-7): B29C45/38; B29C45/80
Attorney, Agent or Firm:
Nobuo Kaida (2 outside)