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Patent Searching and Data


Title:
MOLDING METHOD FOR EMBEDDING LINEAR PART WITHIN MOLDING PART
Document Type and Number:
Japanese Patent JPH08197547
Kind Code:
A
Abstract:

PURPOSE: To realize a thin molded matter in a continuous form or curved form by a method wherein the movability between the molded part and its inner part is maintained and the distortion, offsetting, or squeezing-out of the integrally molded inner part are prevented from developing due to molding injection pressure and pressurizing force.

CONSTITUTION: Within a mold 1, fixing pins 2 are erected along a continuous length or curved form so as to fix a piano wire, rigid material or heating wire 3 to the fixing pins 2.


Inventors:
MITSUISHI MIKIO
Application Number:
JP4604895A
Publication Date:
August 06, 1996
Filing Date:
January 26, 1995
Export Citation:
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Assignee:
SANKI SEISAKUSHO KK
International Classes:
B29C33/14; B29C33/12; B29C39/10; B29C43/18; B29C45/14; B29C70/68; B29K105/20; (IPC1-7): B29C33/14; B29C43/18; B29C45/14
Domestic Patent References:
JPS58109041A1983-06-29
JPS58139100A1983-08-18
JPS6172453A1986-04-14