PURPOSE: To eliminate the need for costly depositing devices and mold cores inexpensively by using processes such as of contacting and placing films on the surfaces of two split patterns respectively under reduced pressure, affixing adhesive tapes along the mating faces to form the integral molding film, etc.
CONSTITUTION: Flexible films 11, 12 are respectively sucked and contacted through a vacuum pump on the surfaces of a lower pattern plate 1 formed with a pattern recess 2 at the center and provided with the multiple vent holes 4 communicating with a pressure reducing chamber 3 and the suction pipe 5 communicating to the vacuum pump and an upper pattern plate 6 constituted in the similar manner, after which both pattern plates 1, 6 are mated. Next, adhesive tapes 13 are affixed to the bonding surfaces of the peripheral edges of the pattern recesses 2, 7 to form an integrally molding film 14. A suction pipe 15 is held by a shield member 16 and is inserted into the abovementioned molding space, thence filler 20 is filled and the opening is sealed with synthetic resins, after which the filler is set under reduced pressure. The rest are executed by ordinary methods, whereby the core molding is accomplished. In this way, the need for costly film depositing devices with conventional methods is eliminated.
MAKIGUCHI TADASHI
SUGIURA HAJIME
Next Patent: MOLDING METHD OF INTEGRAL CORE BY REDUCED PRESSURE MOLDING METHOD