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Title:
MOLDING METHOD FOR LAMINATED MOLDED OBJECT AND MOLD THEREFOR
Document Type and Number:
Japanese Patent JP2004050419
Kind Code:
A
Abstract:

To provide a method for molding a laminated molded object wherein a skin is integrally laminated to the surface of a resin core material and a mold therefor, to simplify skin setting work, to shorten a molding cycle and to prevent the surface of a product from wrinkling to apply an excellent appearance designability to the product.

An upper mold pad 60 and a lower mold pad 70 are arranged along the outer periphery of the product cavity C of upper and lower molds 30 and 40. The setting work of the skin 12 is completed only by setting the skin 12 to the upper surface of the lower mold pad 70 provided to the outer periphery of the cavity C of the lower mold 40. Then, the upper and lower mold pads 60 and 70 are brought to a contact state before mold clamping to hold the peripheral edge part of the skin between both of them in a clamped state. Thereafter, a molten resin M is injected in the product cavity C to fill the same not only to prevent the skin 12 from being excessively drawn in the molds but also to apply proper tension to the skin 12 at the time of molding to prevent the wrinkling of the product at the time of molding.


Inventors:
HARA MASAHIKO
ONO TATSUFUMI
AIZAWA HIROYUKI
Application Number:
JP2002206895A
Publication Date:
February 19, 2004
Filing Date:
July 16, 2002
Export Citation:
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Assignee:
KASAI KOGYO KK
International Classes:
B29C45/26; B29C43/18; B29C43/32; B29C45/14; B29L31/58; (IPC1-7): B29C45/14; B29C43/18; B29C43/32; B29C45/26
Attorney, Agent or Firm:
Shigenori Wada