Title:
低融点金属合金の成形方法
Document Type and Number:
Japanese Patent JP4009601
Kind Code:
B2
Abstract:
A method of molding a low melting point metal alloy which exhibits thixotropy properties at a solid-liquid coexisting temperature, said method comprising the steps of heating said metal alloy at a temperature in the solid-liquid coexisting temperature region to form a semisolid, supplying said semisolid to a heating/holding cylinder to be accumulated, and injecting said semisolid into a mold. At the end of the molding process, a remaining semisolid material is heated to a wholly molten state, then discharged by injection, and heating is stopped so that the molding operation is finished; or, at a temporary suspension of molding, an accumulated material is heated to a wholly molten state and, at the resumption of molding, the temperature of the heating holding cylinder is lowered to the original solid-liquid coexisting temperature region while discharging said wholly molten material by injection and resupplying with new semisolid molding material.
Inventors:
Kazuo Anzai
Koji Takei
Takashi Yamazaki
Koji Takei
Takashi Yamazaki
Application Number:
JP2004055274A
Publication Date:
November 21, 2007
Filing Date:
February 27, 2004
Export Citation:
Assignee:
Nissei Plastic Industry Co., Ltd.
International Classes:
B22D17/00; B22D17/02; B22D17/08; B22D17/20; B22D17/32; B22D23/00; B22D25/00
Domestic Patent References:
| JP2001138025A | ||||
| JP11156522A | ||||
| JP9272945A | ||||
| JP62080487A |
Attorney, Agent or Firm:
Teruo Akimoto
Sowa Kato
Sowa Kato