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Patent Searching and Data


Title:
MOLDING AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2011121183
Kind Code:
A
Abstract:

To provide a method for manufacturing a molding by which the molding provided with a bent part at a base material including an electroconductive material layer can be inexpensively manufactured.

The method for manufacturing the molding comprises (a) a process for forming the electroconductive material layer (the electroconductive material layer composed of a network of an one-dimensional electroconductive material) 12 which is formed by randomly piling an acicular electroconductive material on a surface of a base material 11 consisting of a transparent plastic material based on a film-forming method using a solution where the acicular electroconductive material is dispersed and (b) after the process (a), a process for providing the bent part 13 at the part of the base material including the electroconductive material layer 12.


Inventors:
MARUYAMA RYUICHIRO
Application Number:
JP2009278370A
Publication Date:
June 23, 2011
Filing Date:
December 08, 2009
Export Citation:
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Assignee:
SONY CORP
International Classes:
B29C43/02; B29C53/04; B32B1/00; B32B7/02; B32B37/00; B29L9/00
Attorney, Agent or Firm:
Takahisa Yamamoto
Masaaki Yoshii
Koichi Mori