Title:
MOLDING METHOD FOR METALLIC PLATE AND ADHESIVE SHEET
Document Type and Number:
Japanese Patent JP3044516
Kind Code:
B2
Abstract:
PURPOSE: To improve the drawing property to metal molds so that drawing is sharply finished without sticking of an adhesive to the metal molds when the drawing is executed.
CONSTITUTION: This method has a stage for depositing an adhesive sheet formed by depositing the adhesive 3 on the surface of a film 2a subjected to a matte treatment onto one surface of a metallic plate 1 and laminating a flexible film 4 with a tacky adhesive on the other surface of this metallic plate 1, a stage for peeling the film 2a subjected to the matte treatment and a stage for mounting the metallic plate 1 into the metal molds in such a manner that the adhesive 3 surface of the metallic plate comes into contact with the one metal mold 5a and the flexible film 4 side of the metallic plate 1 comes into contact with the other metal mold 5, then subjecting the metallic plate to outside shape blanking simultaneously with drawing.
Inventors:
Masanao Watanabe
Misao Konishi
Sakata Koshio
Misao Konishi
Sakata Koshio
Application Number:
JP14083193A
Publication Date:
May 22, 2000
Filing Date:
June 11, 1993
Export Citation:
Assignee:
Sony Chemical Co., Ltd.
International Classes:
B21D22/20; B21D22/02; C09J5/02; C09J7/02; C09J123/08; C09J131/04; (IPC1-7): B21D22/20; B21D22/02; C09J7/02
Domestic Patent References:
| JP5562543U |
Attorney, Agent or Firm:
Hidemori Matsukuma
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