Title:
MOLDING METHOD AND MOLD
Document Type and Number:
Japanese Patent JP3439992
Kind Code:
B
Abstract:
PROBLEM TO BE SOLVED: To obtain a good bonded state when a thermoplastic resin sheet is bonded to a base material having a three-dimensional shape by sucking the thermoplastic resin sheet brought into contact with the upper surface of a mold through the base material by secondary vacuum pressure action to bond the same to the inner surface of the base material and molding the bonded sheet and base material into an integrated molded product.
SOLUTION: A base material (a) formed into a deep tray shape from an air permeable material such as paper, leather or cloth is inserted into the cavity 2 of a mold 1 by an automatic insertion device or manual operation and, almost at the same time as this insertion, the base material (a) is sucked through the vacuum hole provided to the mold 1 and an adsorbing plate 10 high in air permeability by primary vacuum pressure action to be held to the cavity 2 in a close contact state. Subsequently, the mold 1 is raised and moved and, when the upper surface thereof comes into contact with a thermoplastic resin sheet (s), a vacuum molding circuit is changed over from primary vacuum pressure to secondary vacuum pressure and the sheet (s) is drawn to the base material (a) by secondary vacuum pressure action to be smoothly bonded to the inner surface thereof.
Inventors:
Takai, Toshihiro
Yokoi, Hiroyoshi
Yoshikoshi, Akio
Yokoi, Hiroyoshi
Yoshikoshi, Akio
Application Number:
JP1998000201680
Publication Date:
June 13, 2003
Filing Date:
July 16, 1998
Export Citation:
Assignee:
ASANO KENKYUSHO:KK
International Classes:
B29C51/36; B29C51/10; B29C51/12; B29C51/42; B29L9/00; B29C51/30; B29C51/00; B29C51/10; B29C51/26; (IPC1-7): B29C51/12; B29C51/10; B29C51/36; B29C51/42