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Patent Searching and Data


Title:
MOLDING METHOD OF PREFORM
Document Type and Number:
Japanese Patent JPH05287410
Kind Code:
A
Abstract:

PURPOSE: To prevent the fluctuation in density.

CONSTITUTION: The die consisting of a die 2 having a recessed part 3 on a mold surface, a punch having a projecting part corresponding to this recessed part on the mold surface and a master mold enclosing the punch and the die is used. A molding material A is first charged into this die 1 and is deposited on the mold surface of the die 2. The molding material A is then compressed by the punch to form a preform having a uniform thickness. The charging of the molding material A is executed after a film 7 is flatly held on the mold surface of the die 2 in such a case.


Inventors:
YAMAUCHI TOSHIO
Application Number:
JP12125092A
Publication Date:
November 02, 1993
Filing Date:
April 15, 1992
Export Citation:
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Assignee:
SUZUKI MOTOR CO
International Classes:
C22C47/08; C22C47/00; C22C47/02; C22C47/06; (IPC1-7): C22C1/09
Attorney, Agent or Firm:
Nao Okuyama (2 outside)