Title:
超塑性・拡散接合パネルの成形方法
Document Type and Number:
Japanese Patent JP4972292
Kind Code:
B2
Abstract:
A method of forming a super plastic diffusion bonding panel is described. A plate (51,52) that forms a face of the panel is set into a forming mold (30), and while the plate (51,52) is pressed to face sheet by gas pressure (P1,P2,P3), spring (54), metal honeycomb (55,56), and the like, the plate (51,52) is moved along with expansion of the panel, thus super plastic molding is conducted.
Inventors:
Shinichi Tanishima
Application Number:
JP2005161518A
Publication Date:
July 11, 2012
Filing Date:
June 01, 2005
Export Citation:
Assignee:
Fuji Heavy Industries Ltd.
International Classes:
B21D26/021; B21D26/031; B21D26/055; B21D26/059; B21D53/92; B23K20/00; B64C1/00
Domestic Patent References:
| JP9047825A | ||||
| JP2002018532A | ||||
| JP2001500793A | ||||
| JP59169692A | ||||
| JP2004314158A |
Attorney, Agent or Firm:
Hiroshi Arafune
Yoshio Arafune
Yoshio Arafune