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Patent Searching and Data


Title:
MOLDING METHOD OF WOOD PRODUCT
Document Type and Number:
Japanese Patent JPH07195314
Kind Code:
A
Abstract:

PURPOSE: To provide a method for molding a wood product wherein a resin content is lowered, a wood product whose strength is uniform and high can be easily formed, and machining such as finishing working is not necessary.

CONSTITUTION: A molding material 6, which is made by kneading 1 weight ratio or above of vegetable fiber material with 1 weight of thermosetting resin having a dielectric loss tangent of 0.01 or above, is injected into a formwork 3. The formwork 3 is laid on a lower plate 2 mounted on an up-and-down lower cylinder 1. An upper plate 4 mounted on an upper cylinder 5 is made to descend so as to press the formwork by a pressure of 8kg/ cm2 or below. Further, the lower plate 2 is made to be a positive electrode and the upper plate 4 is made to be a negative electrode so as to operate a high-fre quency dielectric heating device and set the molding material 6 in the formwork 3 with heat. Thus, an original form of a wood product which requires various forms and strengths can be obtained without machining, and the quantity of the resin is extremely lowered comparing with a conventional method, thereby obtaining a wood product light in weight.


Inventors:
KASUYA TETSUO
Application Number:
JP35205893A
Publication Date:
August 01, 1995
Filing Date:
December 29, 1993
Export Citation:
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Assignee:
KASUYA TETSUO
International Classes:
B27N1/00; B27N3/04; (IPC1-7): B27N3/04; B27N1/00
Attorney, Agent or Firm:
Yoshihisa Oshida