Title:
MOLDING METHOD
Document Type and Number:
Japanese Patent JP2013107297
Kind Code:
A
Abstract:
To provide a molding method for continuing stable production without any troubles during transfer or supplying tablets into a molding machine, when tablets formed of hard-to-trear thermosetting resin composition are used.
In the molding method, a cylindrical tablet which is obtained by tabletting the thermosetting resin composition is supplied into a pot in a mold for transfer molding through a tablet supply device or a carrying device which are not temperature-controlled. In this method, the time from when the cylindrical tablet which is cooled to reduce the surface temperature to -40°C to 10°C is filled into the supply device or the carrying device to when it is supplied into the pot in the mold for transfer molding, is 2 min or less.
Inventors:
IBA TOSHIAKI
HIRABAYASHI KAZUHIKO
OZAKI SHUHEI
HIRABAYASHI KAZUHIKO
OZAKI SHUHEI
Application Number:
JP2011254517A
Publication Date:
June 06, 2013
Filing Date:
November 22, 2011
Export Citation:
Assignee:
KANEKA CORP
International Classes:
B29C45/02; B29C45/76
Previous Patent: FLOATING PREVENTION DEVICE OF SHEET, SHEET PRINTING MACHINE, AND FLOATING PREVENTION METHOD
Next Patent: ENVELOPE MANUFACTURING METHOD
Next Patent: ENVELOPE MANUFACTURING METHOD