Title:
成形方法
Document Type and Number:
Japanese Patent JP7426699
Kind Code:
B2
Abstract:
To provide a molding method that alleviates a problem of mold storage.SOLUTION: First, a 3D (three-dimensional) data of a 3D molding resin mold is stored in a storage medium (S1). Next, when the molding mold is to be used, the 3D data of the molding mold is downloaded from the storage medium and acquired (S2). If the molding mold is not used, not proceed to (S2). Next, based on the acquired 3D data of the molding mold, a part or all of the actual molding mold is molded by using a resin material with a 3D printer (S3). The molded molding mold is a so-called resin mold. Then, proceed to an actual assembly (S4) of the molding mold. Next, in (S4), molding is performed by using the actual molding mold prepared in (S3) to obtain a desired number of actual molded product (S5). Once the desired number of actual molded product has been obtained (S5), the actual molding mold are discarded (S6).SELECTED DRAWING: Figure 1
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Inventors:
Yoshihiro Hashizume
Application Number:
JP2020003927A
Publication Date:
February 02, 2024
Filing Date:
January 14, 2020
Export Citation:
Assignee:
Suwanee Co., Ltd.
International Classes:
B29C33/40; B29C64/379; B29C33/70; B29C64/386; B33Y40/00
Domestic Patent References:
| JP2016028876A | ||||
| JP2005199567A | ||||
| JP2007168424A | ||||
| JP2019509192A | ||||
| JP2011502061A |
Foreign References:
| US10493689 |
Attorney, Agent or Firm:
Hideyuki Teraoka