Title:
MOLDING DIE
Document Type and Number:
Japanese Patent JP2022043699
Kind Code:
A
Abstract:
To provide a molding die which can easily perform adjustment of strength in a molded product.SOLUTION: A molding die 2 has a molding surface 60. The molding surface 60 has a first region E1 for cooling a metallic pipe material 40. The first region E1 can perform quenching by cooling the metallic pipe material 40 when molding. Consequently, strength of a quenched part 51 of a metallic pipe 41, which has been molded by the first region E1, becomes high. On the other hand, the molding surface 60 has a second region E2 which is formed on a part of the molding surface 60, and is configured from a low thermal conductivity material 64 having lower thermal conductivity compared with the first region E1. The second region E2 may have a lower heat radiation speed for the metallic pipe material 40 compared with the first region E1. Therefore, the second region E2 can form a non-quenching part 51 of which the strength becomes low by not quenching (or weakly quenching) in the metallic pipe material 41.SELECTED DRAWING: Figure 3
More Like This:
Inventors:
YAMAUCHI HIROSHI
Application Number:
JP2020149127A
Publication Date:
March 16, 2022
Filing Date:
September 04, 2020
Export Citation:
Assignee:
SUMITOMO HEAVY INDUSTRIES
International Classes:
B21D26/047
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Yasuki Yanagi
Yoshiki Kuroki
Yasuki Yanagi
Previous Patent: Substrate processing method, storage medium and substrate processing equipment
Next Patent: Cutting edge guard
Next Patent: Cutting edge guard