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Patent Searching and Data


Title:
MOLDING MOUNTING STRUCTURE
Document Type and Number:
Japanese Patent JPS5996028
Kind Code:
A
Abstract:

PURPOSE: To enable adhesives to be uniformly applied on adhesive surfaces while preventing the outflow of the adhesives even when the adhesives are applied deviated, by scraping up the adhesives to adhesive reservoirs at both sides with lips when a molding is mounted.

CONSTITUTION: Adhesives 3 are at first applied on the adhesive surface 43 of a molding 5 when the molding 5 is mounted, and thereafter the adhesive portion 4 of the molding 5 is presses against a mounting surface A so that an end 46 of a lip 45 bears against the mounting surface A. When said adhesive portion 4 is further pressed, said end 46 slides as it contacts elastically the mounting surface A to knock down the lip 45 so that the adhesives 3 bears against the mounting surface. And overfolwing adhesives 3b are scraped up by the end 46 and forcibly put into an adhesive reservoir 44. Then, even when the application of the adhesives 3 is deviated, the adhesives 3 is forcibly put in one adhesive reservoir 44 by the lip 45 as soon as the other reservoir 44 is filled with the adhesives. Thus, the adhesives 3 can be applied uniformly on the adhesive surface while the overflow of the adhesives 3 can be prevented.


Inventors:
OKAMOTO ICHIROU
Application Number:
JP20529782A
Publication Date:
June 02, 1984
Filing Date:
November 22, 1982
Export Citation:
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Assignee:
NISSAN MOTOR
International Classes:
B60R13/04; F16B11/00; (IPC1-7): B60R13/04
Domestic Patent References:
JP57063755B
Attorney, Agent or Firm:
Hiroki Sasai