Title:
MOLDING PHENOLIC RESIN MATERIAL
Document Type and Number:
Japanese Patent JPS54107953
Kind Code:
A
Abstract:
PURPOSE: To improve heat stability and rigidity at a high temperature, and to increase a cure rate, by adding resol diluted with a plastifiable material evaporable at a molding temperature to a novolak-type phenolic resin molding material.
CONSTITUTION: 100 parts by wt. of a molding material compositin consisting mainly of novolak is blended with 1W10 parts by wt of resol diluted with a plastifiable material having a boiling point not higher than 170°C. Methanol, n-butyl alcohol, hexanol, styrene, toluene,water, etc. may be cited as the plastic material. The solid content of the resol diluted with the plastic material is preferably 10W70 wt.%.
Inventors:
TORII MUNETOMO
KONYA TAKASHI
KONYA TAKASHI
Application Number:
JP1582278A
Publication Date:
August 24, 1979
Filing Date:
February 13, 1978
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
C08L61/00; C08L61/04; C08L61/06; (IPC1-7): C08L61/06