Title:
MOLDING OF RESIN MOLDING
Document Type and Number:
Japanese Patent JP3050771
Kind Code:
B
Abstract:
PURPOSE: To enhance the close adhesiveness of a thermosetting resin molding material and a coating material in a method for molding a resin molding by molding the thermosetting resin molding material using a split mold and subsequently injecting the coating material into the mold.
CONSTITUTION: In a method for molding a resin molding by molding the thermosetting resin molding material 2 using a split mold 1, and subsequently injecting the coating material 3 into the mold, the set value of the surface temp. of the mold is made low in the direction separated from the arranging position of the thermosetting resin molding material 2.
Inventors:
Yamauchi, Satoru
Ikegawa, Naoto
Azuma, Keiji
Kobayakawa, Masunori
Matsumoto, Masami
Tanaka, Mitsuzo
Oka, Shigeru
Ikegawa, Naoto
Azuma, Keiji
Kobayakawa, Masunori
Matsumoto, Masami
Tanaka, Mitsuzo
Oka, Shigeru
Application Number:
JP1995000086758
Publication Date:
March 31, 2000
Filing Date:
April 12, 1995
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS LTD
NIPPON SHOKUBAI CO LTD
NIPPON SHOKUBAI CO LTD
International Classes:
C08F16/00; C08F16/16; C08F18/00; C08F18/02; C08F20/00; C08F20/10; C08F20/34; C08F20/38; C08F216/12; C08F218/02; C08F220/26; C08F220/34; C08F220/38; C09D4/02; C09J133/04; C08F16/00; C08F18/00; C08F20/00; C08F216/00; C08F218/00; C08F220/00; C09D4/02; C09J133/04; (IPC1-7): B29C43/14; B29C33/02; B29C39/10; B29C39/12; B29C43/20; B29C43/52; B29C43/58; B29C45/14; //B29K101:10; B29K105:06; B29L9:00
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