Title:
MOLDING OF RESIN
Document Type and Number:
Japanese Patent JPS5422459
Kind Code:
A
Abstract:
PURPOSE: To disperse the weld forming positin and to improve the bending stress of weld planes of molded resin articles, by making the thickness of weld parts of molded articles due to the concentration of moltenr esins injected from the flash gate larger than the other parts.
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Inventors:
NAKAMURA SHIYOUZOU
AOKI MASAYOSHI
IIZUKA KAORU
AOKI MASAYOSHI
IIZUKA KAORU
Application Number:
JP8666277A
Publication Date:
February 20, 1979
Filing Date:
July 21, 1977
Export Citation:
Assignee:
HITACHI LTD
International Classes:
B29C45/00; B29B7/00; B29C39/00; B29C39/02; B29C39/24; B29C39/40; B29C41/00; B29C45/26; B29C45/77; (IPC1-7): B29C5/00; B29F1/00